Nickel-Palladium-Gold Pre-Plated Leadframes

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Possehl Electronics offers FULL area pre-plated leadframe using Nickel-Palladium-Gold finish to meet the application needs of Green IC Packaging.

Pre-plated leadframes do not require tin or solder plating processes after leadframe IC is encapsulated at molding, hence it cuts down the assembly cycle time as well as the process costs for post-plating.

Conventional technology using selective silver plating for wire bonding and tin or solder post-plating for soldering

Pre-Plated technology using all-over Ni-Pd-Au plating for both wire bonding and soldering