L1 Post-Treatment Process Adhesion Promoter for Leadframes

Attach Data Sheet

Molding Adhesion is am important aspect on leadframes packages. As stated in the "First Law of Plastic Packaging" by Aphern et al.

"Perfect adhesion at any interface minimize failure"

With the Possehl developed "L-1" Special treatment process on Ag Plated copper leadframe, the adhesion between the leadframe and Molding compound can be increased by several times as compared with the untreated frames.

Surface Treatment is applied on Cu-based packages. It is carried out by acid-dipping to restructure the texture of the surface. The restructuring impact on the frame creates more interfacial contact areas which in turn, multiply the mechanical interlocking effect on the molding compound!

Summary of L1 Treatment Application